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COM Express gains a major interoperability boost
Jeff takes us through the key elements of the forthcoming COM Express Carrier Design Guide. If you have struggled to get your carrier board working with a second COM Express module, or have held off designing due to the buzz about the issues involved, good news has arrived. More than a dozen leading suppliers have set aside their differences to collaborate for a year on a design guide aimed at module interoperability. PICMG is publishing...
Click here to preview in another window preview: http://www.compactpci-systems.com   date: 9/11/2008 ULCLOGO

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Economies of scale helping low-volume design and manufacturing
We highlighted COM Express in the Focus on Form Factors column originally published in our 2007 Resource Guide issue. In that column, Bob Pebly of RadiSys gave us a technical perspective on the key points of the COM Express specification. ''We wanted to revisit the idea with a business perspective on the progress COM Express is making, so we asked Wade Clowes, VP of Commercial Segment at RadiSys, to address a few questions on the trends he...
Click here to preview in another window preview: http://www.pc104online.com   date: 3/28/2008 ULCLOGO

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Low-power module standard poised to open new markets
The latest processor products from chipset manufacturers, such as Intel's Atom Z5xx series CPUs, show a strong trend toward low power consumption figures at high-performance computing levels. Existing Computer-On-Module (COM) standards like COM Express or ETX were defined four to eight years ago without consideration of this low-power trend. Where COM Express defines a maximum power consumption of 188 W, the Qseven specifications describe a 14...
Click here to preview in another window preview: http://www.pc104online.com   date: 6/16/2008 ULCLOGO

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White Paper: Computer-On-Module Designs for the Future of Portable Devices
With the introduction of the Intel® Atom™ processor, handheld and mobile device manufacturers have the capability to meet extreme demands for low power and small size with the cost advantages and broad ecosystem associated with x86 architecture. The cost advantages of COM products based on this new processor have ushered in a rush of modules that are compatible (though not compliant) with the COM Express specification. Because the...
Click here to preview in another window preview: http://www.embedded-computing.com   date: 6/25/2008 ULCLOGO

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